By Riko Radojcic
This ebook offers a pragmatic and a holistic overview of the microelectronic and semiconductor know-how thoughts within the submit Moore’s legislations regime. Technical tradeoffs, from structure right down to production techniques, linked to the 2.5D and 3D integration applied sciences, in addition to the company and product administration issues encountered whilst confronted by means of disruptive expertise recommendations, are provided. assurance contains a dialogue of built-in equipment producer (IDM) vs Fabless, vs Foundry, and Outsourced meeting and try out (OSAT) boundaries to implementation of disruptive know-how options. This publication is a must-read for any IC product workforce that's contemplating getting off the Moore’s legislation tune, and leveraging the various More-than-Moore know-how suggestions for his or her subsequent microelectronic product.
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This ebook provides a pragmatic and a holistic overview of the microelectronic and semiconductor know-how strategies within the put up Moore’s legislation regime. Technical tradeoffs, from structure all the way down to production tactics, linked to the two. 5D and 3D integration applied sciences, in addition to the enterprise and product administration concerns encountered whilst confronted by way of disruptive expertise concepts, are offered.
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Extra info for More-than-Moore 2.5D and 3D SiP Integration
More-than-Moore 2.5D and 3D SiP Integration by Riko Radojcic
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